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GaN Product
Specification
Item | D-GaNCSI-S10 | ||
---|---|---|---|
Size | 10 X 10.5 mm² | ||
Thickness | 350 ± 25 μm | ||
Dislocation Density | From 1 x 10⁵ to 3 x 10⁶ cmˉ² | ||
Orientation | C-Plane (0001) off angle toward M-Axis 0.35 ± 0.15º | ||
TTV | ≤ 10 μm | ||
BOW | ≤ 10 μm | ||
Conduction Type | N-type | ||
Resistivity (300K) | > 10⁶ Ω·cm | ||
Useable area | > 90% | ||
Polishing | Front Surface:Ra<0.2 nm(polished); or <0.3nm(polished and surface treatment for epitaxy) | ||
Back Surface:0.5~1.5μm; option:1-3nm(Fine ground); <0.2nm(polished) | |||
Package | Packaged in a class 100 clean room environment, in single container,under a nitrogen atmosphere. |