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GaN Product
Specification
Item | D-GaN-SPUNSIS | ||
---|---|---|---|
Size | (5.0~10.0) X 10.0 mm² | ||
(5.0~10.0) X 20.0 mm² | |||
Thickness | 350 ± 25 μm | ||
Plane | (2021) (2021) (1122) (1011) | ||
Miscut Angle | -1° ± 0.2° | ||
TTV | ≤ 10 μm | ||
BOW | ≤ 10 μm | ||
Conduction Type & Resistivity (300K) | N-type < 0.1 Ω·cm | ||
N-type < 0.05 Ω·cm | |||
Semi-Insulating > 10⁶ Ω·cm | |||
Dislocation Density | From 1 x 10⁵ to 3 x 10⁶ cmˉ² | ||
Useable area | > 90% | ||
Polishing | Front Surface:Ra<0.2 nm(polished); | ||
Back Surface:1-3nm(Fine ground); option:<0.2nm(polished) | |||
Package | Packaged in a class 100 clean room environment, in single container,under a nitrogen atmosphere. |
Item | D-GaN-SPUNSIS | ||
---|---|---|---|
Size | (5.0~10.0) X 10.0 mm² | ||
(5.0~10.0) X 20.0 mm² | |||
Thickness | 350 ± 25 μm | ||
Plane | (2021) (2021) (1122) (1011) | ||
Miscut Angle | -1° ± 0.2° | ||
TTV | ≤ 10 μm | ||
BOW | ≤ 10 μm | ||
Conduction Type & Resistivity (300K) | N-type < 0.1 Ω·cm | ||
N-type < 0.05 Ω·cm | |||
Semi-Insulating > 10⁶ Ω·cm | |||
Dislocation Density | From 1 x 10⁵ to 3 x 10⁶ cmˉ² | ||
Useable area | > 90% | ||
Polishing | Front Surface:Ra<0.2 nm(polished); | ||
Back Surface:1-3nm(Fine ground); option:<0.2nm(polished) | |||
Package | Packaged in a class 100 clean room environment, in single container,under a nitrogen atmosphere. |